JIEXING ELECTRONIC （HONG KONG） LIMITED

Office:NO.906, Xinnengyuan Building A Seat,Nanhai Street ,NanShan Area
Factroy: I Block , Dongbao Industry , Shasi Village , Shajing Town, Bao'an District, Shenzhen , China
ShenZhen, 518054
China

Tel: 15012700917

Contact: Janet Dai

Email:

Type of Business:

Manufacturer, Trading Company, Exporter/Importer

Employees:

300

Year Established:

2005

Certification:

ISO 9000/9001/9004/19011, ISO/TS 16949, RoHS

Annual Sales Volume:

$25M to $74M

Export Percentage:

21-40%

Annual Purchasing Volume:

$6M to $24M

Contract Manufacturing:

Buyer Labels Offered

Ownership Type:

Limited Liability Company (LLC)

Registered Capital:

$50,000 to $100,000

Bank Ref:

Standard Chartered Bank (China) Limited , Shenzhen Branch

Harmonized System Codes:

8534

Business Message

Factory:SHENZHEN XUN JIE XING CIRCUIT TECH CO.LTD

Marketing systerm:JIEXING ELECTRONIC(HONG KONG) LTD.
SHENZHEN JIEXING ELECTRONIC CO., LTD.

Skype account: junket3
Contract person:Janet Dai
QQ:390476846
Mobile:+86 15012700917
---------------------------------------------- , ------------------
Capability:
Monthly capacity: 10,000 SqM (35,000 SqFt)
Layer Counts: 2-30 Layers
Types of Product: HF and RF (Rogers), HDI, controlled impedance, blind/buried

via/sequential lamination, BGA and fine pitch, unbalanced copper weights, heavy copper (up

to 7oz inner and outer layers)

Material:
Raw material: FR4 (Sheng Yi S1141)
HF material: Rogers, Taconic, Arlon
High TG material: Sheng Yi S1170, ITEQ IT180 and relative PP
Halogen Free material: Sheng Yi S1155 S1165
Solder Mask: Taiyo PSR 2000/4000
PTH, flash, pattern and panel plating solutions: ROHM and HAAS

Surface Finishes:
Leaded HAL, Lead free HAL, ENIG, OSP: (Entek 106) , Immersion Tin, Immersion Silver, Hard

Gold(50u”)
Selective Surface Treatment:
ENIG + OSP, ENIG + Gold Fingers, Immersion Silver + Gold Fingers, Immersion Tin + Gold

Fingers

Tolerance :
Plated holes Tolerance: ±0.075mm （mils±0.05）
Non-plated hole tolerance ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.1mm(mils±0.05-0.075mm)

Functional test:
Insulation Resistance: 50 ohms (standard)
Peel off strength: 1.4N/mm
Thermal Stress: 280 degrees F, 20 seconds
Solder mask hardness : ≥6H
E-Test voltage: 10V-250V
Warp and Twist: ≤0.7%